BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price

Product Details
Customization: Available
Control Mode: Automatic
Voltage: AC220V
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Number of Employees
19
Year of Establishment
2014-05-14
  • BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price
  • BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price
  • BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price
  • BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price
  • BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price
  • BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price
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  • Overview
  • Product Parameters
  • Product Description
Overview

Basic Info.

Model NO.
SD-800
Transport Package
Vacuum Packing and Wooden Case
Specification
L970*W700*H830mm
Trademark
SHENGDIAN
Origin
China
Production Capacity
10000

Packaging & Delivery

Package Size
150.00cm * 120.00cm * 140.00cm
Package Gross Weight
60.000kg

Product Description

BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price

  

SD-800 BGA Rework Station

Features:
1. The integration design of hot air head and mounting head, with automatic mounting automatic welding and automatic removal function.

2. The upper air head adopts hot air system, heating up fast, temperature uniformity, cooling fast (can suddenly drop 50-80 degrees when cooling down), to better meet the process requirements of lead-free welding. Lower heat temperature zone are using infrared + hot air mixed heating, infrared direct action on the heating area, and hot air conduction at the same time, which can make up for the mutual shortcomings, so that the PCB heating fast (heating rate of 10 ºC / S), while still maintaining a uniform temperature;.

3. Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and lower temperature zone to achieve synchronous automatic movement, can automatically reach the bottom of the infrared preheating zone in any position. The lower temperature zone can be moved up and down to support the PCB, which is automatically controlled by motor. To realize the PCB in the fixture does not move, the upper and lower heating head can move to the target chip of the PCB in one piece.

4. PCB cardboard adopts high precision slider to ensure the accuracy of BGA and PCB board placement;

5. The original bottom preheating platform, using Germany imported excellent heating materials (infrared gold-plated light tube) + anti-dazzle constant temperature glass (temperature resistance up to 1800 ºC) preheating area of 500 * 420mm;

6. Preheating platform, plywood device and cooling system can be moved in X direction as a whole. PCB positioning, folding and welding safer and more convenient.

7. X, Y using automatic motor control of movement, so that alignment is fast and convenient, equipment space is fully utilized, with a relatively small equipment volume to achieve a large area of PCB rework, the maximum clamping board size up to 510 * 480mm, no rework dead space.

8. Double rocker control, alignment lens and upper and lower heating platform, thus ensuring alignment accuracy.

9. Built-in vacuum pump, φ angle rotation, precision fine-tuning placement nozzle.

10. Automatic nozzle recognition suction material and mounting height, pressure can be controlled within 10 grams tiny range, with 0 pressure suction material, mounting function, for smaller chips.

11. Color optical vision system with manual X, Y direction movement, with dichroic, magnification and fine-tuning function, including chromatic aberration resolution device, auto-focus, software operation function, can rework maximum BGA size 80*80 mm.

12. A variety of sizes of alloy hot air nozzle, easy to replace, can be rotated 360 ° positioning.

13. Equipped with 5 temperature measurement ports, with multi-point real-time temperature monitoring and analysis function.

14. With solid-state operation display function, so that the temperature control is more safe and reliable.

15. The machine can automatically generate SMT standard temperature disassembly curve in different regions under different environmental temperatures, without manual setting of the machine curve, experienced operators can use, to achieve machine intelligence.

16. With a camera to observe the melting point of the side of the tin ball, easy to determine the curve (this function is optional).

 
Product Parameters
 
Technical Parameters:
Total power 7600W
Upper heating power 1200W
Lower heating power 1200W
Infrared heating power 5000W (2000W controlled)
Power Supply Two-phase 220V, 50/60Hz
Positioning method V-shaped slot to fix PCB, laser positioning lamp for quick positioning, motor can be operated by rocker to move X, Y axis at will.
The number of drive motors and control area 6 (split edge control equipment heating head X, Y-axis movement, alignment lens X, Y-axis movement, the second temperature zone heating head Z1 electric lift, the upper heating head Z-axis up and down movement.
Whether the upper and lower heating heads can be moved as a whole Yes (motorized movement)
Whether the alignment lens can be automatically Yes (automatic movement or manually controlled movement)
Whether the equipment with suction feeding device Yes (standard)
The third temperature zone heating (preheating) mode The use of German imports of infrared heating light tube (advantage: heating fast, the equipment is normally heated, the temperature around the PCB main board and the temperature of the reworked chip position will not form a large temperature difference, to ensure that the PCB main board will not be deformed or distorted phenomenon, can better improve the chip welding yield)
The second temperature zone control mode Electric automatic lifting
Temperature control High-precision K-type thermocouple (K-sensor) closed-loop control (Closed Loop), the upper and lower independent temperature measurement, temperature control accuracy of ± 1 degree.
Electrical options Taiwan touch screen + high precision temperature control module + Panasonic PLC + Panasonic servo + stepper drive
Maximum PCB size 630*480mm (actual effective area, no dead space for repair)
Minimum PCB size 10*10mm
Number of temperature measurement interface 5
Chip enlargement and reduction range 2-50 times
PCB thickness 0.5~8mm
Applicable chips 0.8*0.8~80*80mm
Minimum chip pitch 0.15mm
Maximum loading capacity 800g
Mounting accuracy ±0.01mm
Machine size L970*W700*H830mm
Machine weight Approx. 140KG
                                          
 
Product Description

BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station PriceBGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station PriceBGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price
BGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station PriceBGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station PriceBGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station PriceBGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station PriceBGA Rework PCB BGA Chip Rework Price Infrared SMD Rework Rework Station Price

FAQ:


1) This is the first time I use this kind of machine, is it easy to operate?

There is English manual or guide video that show you how to use machine.

If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.

2) If machine have any problem after I receive it, how can I do ?

Free parts send to you in machine warranty period.

If the part is less than 0.5KG, we pay the postage.

If it exceeds 0.5KG, you need to pay the postage.

3) MOQ ?

1 set machine, mixed order is also welcomed.

4) How can I buy this machine from you? ( Very easy and flexible !)

A. Consult us about this product on line or by e-mail.

B. Negotiate and confirm the final price , shipping , payment methods and other terms.

C. Send you the proforma invoice and confirm your order.

D. Make the payment according to the method put on proforma invoice.

E. We prepare for your order in terms of the proforma invoice after confirming your full payment.

And 100% quality check before shipping.

F.Send your order by air or by sea.

 



 

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